Metal plating method and apparatus

ABSTRACT

An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/076,812 filed on Mar. 31, 2011, the content of which is herebyincorporated by reference.

TECHNICAL FIELD

The application relates generally to plating and, more particularly, toan apparatus and a method suited for metal plating gas turbine enginecomponents.

BACKGROUND OF THE ART

Conventional plating methods, such as electroplating, typically requirethat the component to be plated be immersed in a bath of platingsolution and subject to an electric current. In a tank plating process,the surface areas of the component which do not require plating must bemasked such that plating material is prevented from adhering to thoseareas of the component. The masking procedure is time consuming andlabour intensive.

Brush plating can be used to reduce masking requirements. However, thismethod can require greater operator involvement. An operator dip thebrush (the anode) and the component in a metal plating solution thenapplies it to the component to be plated (the cathode) while a relativemovement is induced between the component and the brush. Only the areasof the component passing by the brush are being plated. The brush hastendency to deteriorate during the process causing the metal platingsolution to prematurely degrade.

In view of the foregoing, there is a need for a new plating method andapparatus.

SUMMARY

In one aspect, there is provided a method of electroplating a localizedarea of a conductive component adapted to be charged as a cathode, themethod comprising: circumscribing the area to be plated with aninjection head carrying an anode, the injection head and the conductivecomponent defining a plating chamber over the localized area to beplated, supplying a plating solution into said plating chamber, theplating solution being in conductive contact with the anode and thecathode; and applying an electric current to said anode.

In a second aspect, there is provided an electroplating apparatus foruse in plating a desired surface area of a conductive component adaptedto be charged as a cathode during a plating process, the apparatuscomprising an injection head sized and shaped to circumscribe thedesired surface area to be plated and isolate same from the remainder ofthe conductive component, the injection head and the desired surfacearea defining a localized plating chamber therebetween, an anodeprovided on the injection head and disposed to face the surface area tobe plated when the injection head is positioned on the conductivecomponent, a supply passage defined in said injection head for allowinga plating solution to be supplied into said localized plating chamber,and an electric contact for connecting the anode to a negative side of asource of current.

In a third aspect, there is provided a method for electroplating alocalized area of a conductive component adapted to be charged as acathode, the method comprising: forming a plating chamber over thelocalized area to be plated by aligning an injection head over thelocalized area and sealingly engaging the injection head on theconductive component, the injection head being sized and shaped to coverthe localized area to be plated, the injection head supporting an anodein close facing proximity to the localized area when installed on theconductive component; injecting a plating solution inside the platingchamber, and subjecting the anode, the conductive component and theplating solution to an electric field.

DESCRIPTION OF THE DRAWINGS

Reference is now made to the accompanying figures, in which:

FIG. 1 is a perspective view of a turbine interstage case having aninner diametric surface requiring material application;

FIG. 2 is a partial cross-sectional view of a plating apparatus whichcan be used to metal plate the inner diametric surface of the turbineinterstage case shown in FIG. 1;

FIG. 2A is an enlarged view of the portion of the plating apparatuscontained in circle 2A-2A in FIG. 2;

FIG. 3 is a bottom view of an injection head of the plating apparatusshown in FIG. 2;

FIG. 4 is an enlarged perspective view of an outer combustor linerhaving an inner diametric surface to be plated; and

FIG. 5 is a perspective view of a plating apparatus having an injectionhead specifically designed to fit on the outer combustor liner shown inFIG. 5 to permit localized plating of the inner diametric surface of theliner.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 illustrates an example of a turbine interstage case 10 having aninner diameter 12 with a radially outwardly facing surface which needsto be plated. Such a case is typically made of a conductive metallicalloy.

FIG. 2 illustrates an embodiment of an electroplating apparatus 20having an injection head specifically designed to permit localizedplating of the radially outwardly facing surface of the inner diameter12 of the turbine interstage case 10 shown in FIG. 1.

The injection head of the plating apparatus 20 may be provided in theform of a bell or hood having a generally hollow cylindrical body 22shaped and sized to fit in a predetermined position within the hollowcentral portion of the turbine interstage case 10. It can be seen fromFIG. 2 that the outside diameter of cylindrical body 22 generallycorresponds to the inner diameter of the central hollow portion of theturbine interstage case 10, thereby providing for a relatively tight fitengagement between the injection head of the plating apparatus 20 andthe turbine interstage case 10. This allows to precisely positioning theinjection head relative to the surface to be plated. The cylindricalbody 22 of the injection head has an axially extending cylindrical wallhaving an inner surface 24 and an outer surface 26. The cylindrical wallof the injection head 22 extends axially integrally from a conical topportion 28 to an open-ended component engaging end portion or base 30.As shown in FIG. 2, the diameter of the inner surface 24 is greater atthe base 30 of the injection head, thereby providing for the formationof an axially downwardly facing inner shoulder 40. The end portion ofthe inner surface 24 which extends axially beyond shoulder 40 at thebase 30 of the distribution head is adapted to closely surround theradially outwardly facing surface of the component inner diameter 12 tobe plated to form therewith a plating chamber. In the illustratedexample, the plating chamber takes the form of an annular plating gap 42adapted to be filled with a plating solution. While the injection headis illustrated in FIG. 2 as having a bell shaped configuration, it isunderstood that the injection head of the plating apparatus 20 may becustom or tailor made to particularly fit the geometry of any specificpart and to appropriately “sealably cover” the localized area to beplated. The expression “sealably covering” is herein intended togenerally means that the plating apparatus 20 allows the creation alocal environment for plating by covering a localized area to be platedso that the localized area to be plated is isolated from remaining partsof the component, thereby substantially eliminating the need for maskingthe surface of the component which does not required plating prior toinitiating the plating process.

The injection head including the hollow cylindrical body 22 and theconical top portion 28 may be manufactured using a rapid prototypingmethod. For instance, a stereolithography process may be used to formthe injection head. It is contemplated to use Fusion Deposition Modeling(FDM) to produce the injection head. According to one embodiment, theinjection head is made from polycarbonate/acrylonitrile butadienestyrene (PC/ABS). Other materials are contemplated as well.

The conical top portion 28 is provided with a central inlet port 32adapted to be connected to a source of a plating solution. The inletport 32 may include a connector (not shown) which may be push fit intothe end of a hose connectable to a plating solution reservoir. It isunderstood that any suitable connector compatible with the platingsolution may be used.

The plating solution may comprise but is not limited to gold, silver,rhodium, chrome, copper, iron, zinc, tin, cadmium, nickel, cobalt, alloysuch as Nickel-Cobalt, brass and solder. According to one example, theapparatus 10 is used to locally plate the interstage case 10 with aNickel solution, such as a sulfamated nickel solution.

The inlet port 32 is connected in fluid flow communication with amanifold portion 34 internally formed within the top conical portion 28and the upper end of the cylindrical body 22 of the injection head. Themanifold portion 34 may be provided with baffles (not shown) foruniformly distributing the incoming flow of plating solution to aplurality of internal helicoidal supply passages 36 defined in theaxially extending wall of the cylindrical body 22 of the injection head.A plurality of circumferentially distributed discharge holes 38 (FIG. 3)may be provided in the axially facing shoulder 40 to direct the platingsolution from the internal passages 36 to the annular plating gap 42. Asshown in FIG. 3, the discharge holes 38 may be angled to promote acircular flow of plating solution in the annular plating gap 42.

The discharge holes 38 are axially aligned with the plating gap 42 andangled from the axial direction so as to impart a tangential componentto the flow of plating solution in a plane normal to the axialdirection. Any angle which provides adequate flow and coverage isacceptable. It has been found for this particular application that anangular range of 10 to 15 degrees promote sufficient flow circulation ofthe solution to enhance ion replenishment.

The apparatus 20 also comprises an anode 44. The anode 44 is carried onthe inner surface 24 at the base 30 of the injection head. The anode 44may be provided in the form of an annular electrode extending along thefull circumference of the mouth of the base 30. As shown in FIG. 2, theanode 44 fully covers the portion of the inner surface 24 which extendsaxially beyond the inner shoulder 40. The anode 44 thus axially extendsin the plating gap 42 in close opposed facing relationship with thesurface to be plated once the injection is aligned and seated on theturbine interstage case 10. The injection head allows for the anode 44to be positioned in close uniformly controlled distance to the radiallyouter surface of the inner diameter 12 for improved plating performance.The ring-shaped anode 44 provides 360 degrees coverage of the surface tobe plated during 100% of the plating process, thereby obviating the needfor moving the anode 44 relative to the case 10 during the platingprocess. The injection head and the case 10 can remain static during allof the plating cycle. Depending on plating thickness and the componentgeometry, the distance between the anode 44 and the radially outersurface of the inner diameter 12 of the case 10 may be comprised betweenabout 0.035 inches to 0.070 inches.

The anode 44 may be an insoluble anode (i.e. an anode that resistsdissolution during the plating process). The anode 44 is selected butnot limited to carbon, lead, steel, platinum, titanium or other suitableanode material. The anode 44 and all the metallic parts of the platingapparatus 20 may be plated to avoid their degeneration during theplating process. According to a specific application, the anode 44 isplatinum plated titanium alloy.

As shown in FIGS. 2 and 3, the plating apparatus 20 comprises a DCconnector for providing direct current to the localized area to beplated. Specifically, the plating apparatus 20 may have an elongated busbar 46 integrated or embedded in the wall of the cylindrical portion ofthe injection head. The bus bar 46 extends axially from an upper end ofthe cylindrical portion down to the anode 44 for conducting anelectrical current thereto. The bus bar 46 is disposed radially outsideof the internal passages 36. The bus bar 46 has a lower end portion 50which is held in conductive contact with the anode 44. The opposed upperend portion 48 of the bus bar 46 is adapted to be connected to a buslead 52 protruding through a radial opening 54 (FIG. 2) defined in anupper end portion of the cylindrical the body 22. The bus lead 52 may beconnected to the positive terminal of a power supply or a rectifier (notshown) while the turbine interstage case 10 is connected to the negativeterminal of the power supply.

Alternatively, The bus lead 52 may be connected to a source (not shown)of direct current or a rectifier and the turbine interstage case 10 maybe grounded for providing direct current to the outer surface of theinner diameter 12 of the turbine interstage case 10 to be plated.

The injection head of the plating apparatus 20 is insulated with anon-conductive material for separating the anode 44 from other areas ofthe turbine interstage case 10 not to be plated. Any suitable materialwhich is non-conductive and can withstand the solutions temperature andchemical attack without depreciable degradation could be used.

Although the design shown in FIGS. 1 to 3 is for a particularapplication, variations to the above described design are well acceptedamong a large family of various engine components. For instance, FIGS. 4and 5 illustrate another potential application in which the injectionhead of a plating apparatus 120 is moulded or otherwise formed to matewith the inner diameter area 112 of an outer combustor liner 110. Theinjection head is shaped and sized to fit in a predetermined positionover the combustor liner 110 in which the area to be plated issurrounded by the injection head with the anode of the injection headfacing the area to be plated from one side of a locally formed platingchamber. Other applications are contemplated as well, FIGS. 4 and 5being solely another possible application of the present concept.

In use, the injection head of the plating apparatus 20, 120 is alignedover the area to be plated and is then seated in position on thecomponent 10, 110 so as to circumscribe the area to be plated and form alocalized plating chamber thereover. The component 10, 110 and the anode44 carried by the injection head are then respectively connected to thenegative and positive sides of a power supply. The inlet 32 of theinjection head is connected to a source of plating solution. Once theapparatus has been so installed, the plating solution flowing from thesource of plating solution into the injection head is discharged intothe plating gap 44 via the discharge holes 38 and the power supply isswitched on to apply current with no further special attention requiredthroughout its time cycle. Current can be applied after the solution hascirculated and warmed the component to within 5 degrees Fahrenheit ofthe solutions operational temperature. The solution is allowed to flowover and out of the component after passing through the “effective gap”in which the act of plating exists. The solution is not contained butallowed to re-circulate back to the solution reservoir to be reheatedand pumped back to the gap as required. The component being plated ispositioned in a container (not shown) that has draining capabilities.This allows for the solution to be re-circulated back into the reservoiror tank to be reused. Upon reaching the desired plating thickness,current is stopped and solution flow is ended.

The injection head assembly can utilize features of the component toposition the unit in its design. This is useful for maintaining theoptimum gap between the anode and the cathode. An example could beanother diameter on the component that is concentric to the onerequiring plating to position the anode at a controlled gap. This can bedesigned in the injection head.

By so locally forming plating chamber over the area to be plated thereis no longer a need for plating tank submersion of the component. Theprovision of 100% anode coverage of the surface to be plated providesfor cycle time reduction. Operators involvement is also not requiredduring duty cycle. It minimizes human exposure to the plating solutionand gases. The isolation of the surface to be plated also eliminate theneed for extensive or need of component masking. This contributes tosignificantly reduce the pre-process preparation of the parts to beplated. The controlled positioning of the anode relative to the surfaceto be plated contributes to improve efficiency and surface finish.Another advantage resides in the fact that no specialized tools ormotorized equipment is needed to induce a relative movement between theanode and the part to be plated during the plating process. The anodeand the part remain static during all the process. Contamination isvirtually non existent.

This enables full depletion of solution. Because of materials being usedin the process and the fact that these materials do not degrade thesolution absent of contaminations that would otherwise affect theprocess is eliminated.

The above description is meant to be exemplary only, and one skilled inthe art will recognize that changes may be made to the embodimentsdescribed without departing from the scope of the invention disclosed.For example, the structure for supplying the plating solution to theplating gap can adopt various configurations. For instance, a simplefluid passage with one inlet and one outlet could be defined through thebody of the injection head in order to direct a flow of plating solutioninto the plating chamber. Also the shape of the injection head is notlimited to just round components but can also be adapted to irregularshapes and patterns and items without symmetry or formal arrangements.Still other modifications which fall within the scope of the presentinvention will be apparent to those skilled in the art, in light of areview of this disclosure, and such modifications are intended to fallwithin the appended claims.

What is claimed is:
 1. An electroplating apparatus for use in plating adesired surface area of a conductive component adapted to be charged asa cathode during a plating process, the apparatus comprising aninjection head sized and shaped to circumscribe the desired surface areato be plated and isolate same from the remainder of the conductivecomponent, the injection head and the desired surface area defining alocalized plating chamber therebetween, an anode provided on theinjection head and disposed to face the surface area to be plated whenthe injection head is positioned on the conductive component, a supplypassage defined in said injection head for allowing a plating solutionto be supplied into said localized plating chamber, and an electriccontact for connecting the anode to a negative side of a power supply.2. The electroplating apparatus defined in claim 1, wherein theinjection head has a non-conductive hood body adapted to cover thesurface area to be plated, the non-conductive hood body having acomponent engaging end portion adapted to be seated against theconductive component, said component engaging end portion defining acavity to provide for the formation of said localized plating chamberbetween the desired surface area to be plated and the injection head,the anode extending over a wall of said cavity.
 3. The electroplatingapparatus defined in claim 2, wherein the anode extends along a fullperimeter of said cavity.
 4. The electroplating apparatus defined inclaim 3, wherein the anode is provided in the form of an annular bandencircling a distal end potion of said cavity.
 5. The electroplatingapparatus defined in claim 2, wherein the supply passage has at leastone outlet extending to said cavity.
 6. The electroplating apparatusdefined in claim 5, wherein the anode is provided in the form of anannular band encircling a distal end portion of said cavity, and whereinsaid at least one outlet comprises a plurality of circumferentiallydistributed outlets defined in an end wall of the cavity, thecircumferentially distributed outlets being disposed radially inside theannular band.
 7. The electroplating apparatus defined in claim 6,wherein the circumferentially distributed outlets are angled to promotea circular flow of plating solution inside the cavity.
 8. Theelectroplating apparatus defined in claim 5, wherein the supply passagehas an inlet adapted to be connected to a source of plating solution,and at least one helicoidal passage extending about said cavity fordirecting a flow of plating solution from said inlet to said at leastone outlet.
 9. The electroplating apparatus defined in claim 2, whereinthe anode is an insoluble anode selected from carbon, lead, steel,platinum, titanium and other suitable insoluble anode material.
 10. Theelectroplating apparatus defined in claim 2, wherein the non-conductivehood body is made of polycarbonate/acrylonitrile butadiene styrene.